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AUTOMATIC WAFER TRANSFER：AWT300LC-S

Specifications/ Features:

AWT300LC-S_edited.png

  • Wafer size 300 mm (12”)

  • Sorting of two wafer sizes in one machine

  • Robot with FOSB mapping function

  • Pre-aligner module for 200 mm (8”) and 300 mm (12”) wafer

  • Cross slot wafer detection

  • Wafer protrusion detection

  • Touch screen display

  • Top side OCR module

  • Windows PC-Based user friendly Graphical User Interface

  • Wafer sorting selection by recipe or operator

  • Live sorting Graphical User Interface

  • Up to 180 WPH

Optional Features:

  • Wafer size 200 mm (8”)

  • SECS/GEM

  • Wafer-ID reader for OCR and barcode

  • Dual end effector for maximum throughput

  • Vision pre-aligner for 200 mm (8”) and 300 mm (12”)

  • wafer (only top OCR configuration available)

  • Auto recipe selection

  • UPS (uninterruptable power supply)

  • CDA and N2 pressure indicator

  • Bottom side OCR module

  • Additional 3rd Load port for Split and Merging

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