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Specifications/ Features:
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Wafer size 300 mm (12”)
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Sorting of two wafer sizes in one machine
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Robot with FOSB mapping function
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Pre-aligner module for 200 mm (8”) and 300 mm (12”) wafer
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Cross slot wafer detection
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Wafer protrusion detection
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Touch screen display
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Top side OCR module
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Windows PC-Based user friendly Graphical User Interface
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Wafer sorting selection by recipe or operator
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Live sorting Graphical User Interface
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Up to 180 WPH
Optional Features:
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Wafer size 200 mm (8”)
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SECS/GEM
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Wafer-ID reader for OCR and barcode
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Dual end effector for maximum throughput
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Vision pre-aligner for 200 mm (8”) and 300 mm (12”)
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wafer (only top OCR configuration available)
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Auto recipe selection
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UPS (uninterruptable power supply)
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CDA and N2 pressure indicator
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Bottom side OCR module
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Additional 3rd Load port for Split and Merging
Request for
Quotation/ Details
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